TEST_PACKET to Bathtub: Reading a USB 2.0 High-Speed Jitter Analysis at electronica 2026
A USB 2.0 high-speed jitter test, start to finish: TEST_PACKET mode, fixture, 12-bit capture, then eye, TIE, jitter spectrum and bathtub on one...
Technology, Industry & Insight / Europe
What changes.
Why it matters.
What comes next.
Technology news, company perspectives and original analysis. Following semiconductors, AI and the systems reshaping industry — with an engineering view from Europe.
Recent reporting & perspectives
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08 Nov 2026
Same Load, Different Gain: Double-Pulse and Harmonic Load Pull for GaN at EuMW 2026
Maury Microwave’s InsightPro displayed two gain curves at thesame load, from a single-pulse and a double-pulse power sweep, differingby several dB at low...
05 Nov 2026
Microsoft Rallies, Chips Fall: The AI Infrastructure Divide After the US Midterms
Microsoft rallied as chip stocks fell after the US midterms. An engineering view of the divide: data-center permits, power delivery, financing and the...
02 Nov 2026
Know the Limits of Your Own View: Spectrum Monitoring and GNSS PNT Verification at EuMW 2026
Two Keysight stations at EuMW 2026 dealt with the RF world outside the lab: networked spectrummonitoring at 750 MHz with 100 MHz bandwidth,...
28 Oct 2026
Caught Mid-Calibration: Why an 8 GHz Analysis Span at 20 GHz Needs Full-Path Correction
At Keysight’s Master Signal Analysis station, the 89600 VSAshowed an 8 GHz span at 20 GHz while calibrating. The uncorrectedspectrum showed strong tilt...
28 Oct 2026
Delay and Doppler in Motion: What End-to-End NTN Emulation Has to Reproduce
Keysight’s end-to-end NTN demo used a PROPSIM FS16 channelemulator to reproduce a LEO satellite pass: Doppler swinging from about+40 kHz through zero, and...
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A small selection from our commercial catalog. Explore flagship instruments, then browse by measurement task. Product pages provide configuration and availability details.
Where technology meets industry
Research archive →A broad technology perspective, with a current focus on semiconductors and AI. Start with the coverage already in our archive.
Semiconductors & power
Devices, materials and power electronics. What changes in performance, design and adoption?
Explore coverage →AI & computing
AI agents, edge computing and the hardware behind intelligent systems.
Explore coverage →Communications & systems
RF, wireless, satellite links and embedded systems, from devices to infrastructure.
Explore coverage →Engineering evidence
Measurement methods, instruments and technical explainers that put claims in context.
Explore coverage →Research & technical archive
Explore the technical evidence behind the headlines. This archive connects our semiconductor, AI, power electronics and communications coverage with explainers and original field observations.
Archive guide · Updated 5 November 2026. Article dates refer to their original publication; historical field reports retain their event context.
Browse by technology
Power semiconductors
SiC and GaN devices, gate driving, switching behaviour and power characterisation.
RF & microwave
Network analysis, spectrum monitoring, mixers, amplifiers and millimetre-wave measurement.
High-speed & embedded systems
Signal integrity, interconnects, embedded hardware and design validation.
AI in engineering
AI-assisted design, instrument workflows and the practical limits of automation.
Companies & industry
Explore companies through their technology, products and place in the industry. The links below lead to existing AXMEAS coverage; inclusion does not imply a partnership or endorsement.
How to use this archive
- Choose a technology or company above.
- Check each article's publication date and the event or product version discussed.
- Follow the original sources and distinguish an observed demonstration from a general performance claim.
From the exhibition floor
EuMW archive →Look beyond the headline specification. Explore demonstrations, measurement setups and technical questions from EuMW, PCIM and Embedded World.
Original field notesEmbedded World
Technology in context
Technology in context
16 May 2026 · Field notes
Europe Is Weak in AI Narrative. But at Embedded World, I Saw Something Different.
01 May 2026 · Field notes
Power Integrity at PCIM: What OMICRON Lab and Picotest Were Really Asking
01 May 2026 · Field notes
Tektronix vs. Keysight at PCIM: Two Ways to Look Inside a SiC MOSFET
About AXMEAS Signal
Technology in context.
Evidence before conviction.
AXMEAS Signal is a technology and industry publication from Augsburg, Germany. It brings together reporting, company perspectives and original analysis by Thomas Hu — @SignalByThomas — with a background in mathematics, physics and the European test and measurement industry.
Our current focus is semiconductors and AI, alongside power electronics, communications and emerging systems. Test and measurement is our point of entry: a way to question performance claims, understand engineering constraints and connect technology with its commercial implications.
Editorial approach: distinguish verified facts, manufacturer claims and our own interpretation. Publication dates and sources provide context; original photographs and field observations identify what was actually seen. Significant corrections should explain what changed. Send corrections, source material or a topic suggestion with the article link.
Contact AXMEAS →Published by Forestown AXMEAS GmbH · Augsburg, Germany
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